US Patent Issued to FormFactor on June 24 for "Wafer-handling end effectors configured to selectively lift a wafer from an upper surface of the wafer, probe systems that include the wafer-handling end effectors, and methods of utilizing the wafer-handling end effectors" (German Inventors)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,337,467, issued on June 24, was assigned to FormFactor Inc. (Livermore, Calif.).

"Wafer-handling end effectors configured to selectively lift a wafer from an upper surface of the wafer, probe systems that include the wafer-handling end effectors, and methods of utilizing the wafer-handling end effectors" was invented by Benedikt Marx (Dresden, Germany) and Axel Becker (Dresden, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "Wafer-handling end effectors, probe systems that include wafer-handling end effectors, and methods of utilizing wafer-handling end effectors are disclosed herein. The wafer-handling end effectors are configured to selectively...