US Patent Issued to Florida A&M University on Oct. 14 for "System and method of optimizing adhesion dynamics during deposition of thermoplastic materials" (Florida Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,441,053, issued on Oct. 14, was assigned to Florida A&M University (Tallahassee, Fla.).

"System and method of optimizing adhesion dynamics during deposition of thermoplastic materials" was invented by Tarik J. Dickens (Tallahassee, Fla.), Sean Psulkowski (Fernandina Beach, Fla.), Charissa Lucien (Tallahassee, Fla.) and Mingchia Dawn Yang (Tallahassee, Fla.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A device and related methods for determining adhesion dynamics of the rapid deposition of a filament is disclosed herein. The device includes a stage having a top surface. An aperture residing within the top surface of the stage is disposed within a first...