US Patent Issued to Flex on March 4 for "Devices, systems, and methods for stacked die packages" (Chinese, American Inventors)

ALEXANDRIA, Va., March 5 -- United States Patent no. 12,243,850, issued on March 4, was assigned to Flex Ltd. (Singapore).

"Devices, systems, and methods for stacked die packages" was invented by Cheng Yang (Shanghai) and Dongkai Shangguan (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package includes a first chip stack. The first chip stack includes a first chip including first bonding structures, a second chip including second bonding structures facing the first bonding structures and bonded to the first bonding structures, and a first electrical contact on the second chip. At least a portion of the first electrical contact does not overlap with the first chip in a plan view."

The pat...