US Patent Issued to FISERV on July 22 for "High-integrity opaque-inset panel envelope, and method for manufacturing the same" (Texas, Indiana Inventors)

ALEXANDRIA, Va., July 23 -- United States Patent no. 12,365,515, issued on July 22, was assigned to FISERV INC. (Milwaukee).

"High-integrity opaque-inset panel envelope, and method for manufacturing the same" was invented by Jason Corbitt Gaskey (Sugar Land, Texas), Hrishikesh Shashikant Karekar (Sugar Land, Texas), Santosh Kumar (Stafford, Texas) and Stephen Orlando Bozzone (Danville, Ind.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A high-integrity opaque-inset panel envelope includes a front panel formed from a printable material, one or more apertures being defined therethrough, one or more flaps extending from the edges of the front panel, and one or more opaque inset panels/labels disposed on an inn...