ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,531,181, issued on Jan. 20, was assigned to Ferric Inc. (New York).
"Multi-layered metal frame power package" was invented by Michael Lekas (Brooklyn, N.Y.) and Noah Sturcken (New York).
According to the abstract* released by the U.S. Patent & Trademark Office: "An electronics assembly includes a plurality of planar conductive metal sheets including a first conductive metal sheet, a second conductive metal sheet attached and electrically coupled to the first metal sheet, and a third conductive metal sheet attached and electrically coupled to the second metal sheet. The second metal sheet is located between the first and third conductive metal sheets. Air gaps are defined in the plura...