US Patent Issued to Feng Chia University on Sept. 2 for "Mechanical metamaterial with improved compressive responses" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 3 -- United States Patent no. 12,404,385, issued on Sept. 2, was assigned to Feng Chia University (Taichung, Taiwan).

"Mechanical metamaterial with improved compressive responses" was invented by Chien-Yie Tsay (Taichung, Taiwan) and Jiun-Hung Chen (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A mechanical metamaterial comprising a chiral structure and a reentrant structure repeatedly layered to form a 3D structure with improved compressive response is disclosed. The 3D structure of the present invention is a metamaterial which can be perfectly and easily produced by a photocuring 3D printing process without any internal support. The introduction of modified carbon n...