ALEXANDRIA, Va., Feb. 19 -- United States Patent no. 12,230,908, issued on Feb. 18, was assigned to FCI USA LLC (Etters, Pa.).
"High density electrical connectors" was invented by Aymeric Soudy (Franois, France) and Cyril Jeune (Lantenne-Vertiere, France).
According to the abstract* released by the U.S. Patent & Trademark Office: "In various embodiments, compact connector designs may be provided that have reduced board pitch (e.g., 1.80 mm, 1.50 mm, 1.27 mm, etc.), but are still capable of accommodating large electrical conductors (e.g., 1.4 mm, 1.1 mm, 0.9 mm, etc.). In this manner, PCB footprint may be reduced (e.g., by 50% when a staggered connector configuration is used), while adequate current carrying capacity may be maintained (e.g...