US Patent Issued to Fasford Technology on June 10 for "Die bonding apparatus and manufacturing method for semiconductor apparatus" (Japanese Inventors)

ALEXANDRIA, Va., June 18 -- United States Patent no. 12,327,739, issued on June 10, was assigned to Fasford Technology Co. Ltd. (Minami-Alps, Japan).

"Die bonding apparatus and manufacturing method for semiconductor apparatus" was invented by Hideharu Kobashi (Minami-Alps, Japan) and Masayuki Mochizuki (Minami-Alps, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A die bonding apparatus includes a control device for controlling an imaging device. The control device is configured to: detect the dicing grooves by photographing the wafer using the imaging device; roughly determine a central position of the die by calculating the center coordinate of the die on the basis of the detected dicing grooves; move...