US Patent Issued to Fasford Technology on July 29 for "Semiconductor manufacturing apparatus and manufacturing method for semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,576, issued on July 29, was assigned to Fasford Technology Co. Ltd. (Minami-Alps, Japan).

"Semiconductor manufacturing apparatus and manufacturing method for semiconductor device" was invented by Tsuyoshi Yokomori (Minami-Alps, Japan), Tatsuyuki Okubo (Minami-Alps, Japan), Yuki Nakui (Minami-Alps, Japan), Hiroshi Maki (Minami-Alps, Japan), Akira Saito (Minami-Alps, Japan) and Naoki Okamoto (Minami-Alps, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor manufacturing apparatus includes a thrust-up unit having a plurality of blocks in contact with a dicing tape, a head having a collet absorbing the die and capable of being moved up ...