US Patent Issued to FABRIC8LABS on May 20 for "Electrochemical additive manufacturing system having conductive seed layer" (California Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,308,251, issued on May 20, was assigned to FABRIC8LABS INC. (San Diego).

"Electrochemical additive manufacturing system having conductive seed layer" was invented by David Pain (Carlsbad, Calif.), Andrew Edmonds (Oceanside, Calif.), Jeffrey Herman (Solana Beach, Calif.), Charles Pateros (Carlsbad, Calif.) and Kareemullah Shaik (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "A system and method of using electrochemical additive manufacturing to add interconnection features, such as wafer bumps or pillars, or similar structures like heatsinks, to a plate such as a silicon wafer. The plate may be coupled to a cathode, and material for the feature...