US Patent Issued to EZCONN on July 15 for "Isolator and its electronic subassembly" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,363,848, issued on July 15, was assigned to EZCONN Corp. (New Taipei, Taiwan).

"Isolator and its electronic subassembly" was invented by Li Chan Yan (New Taipei, Taiwan) and Ming-Ching Chen (New Taipel, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Some embodiments of the disclosure provide an isolator which includes a body, a first circuit module, and a second circuit module. In some examples, the first circuit module is arranged at a first connecting port of the body and includes a first integrated circuit board, a first shell surrounding the first integrated circuit board, a first signal processing circuit penetrating through the first integr...