ALEXANDRIA, Va., Feb. 11 -- United States Patent no. RE50,796, issued on Feb. 10, was assigned to Exo Imaging Inc. (Redwood City, Calif.).
"Semiconductor package having spacer layer" was invented by Weng Hong Teh (Phoenix), John S. Guzek (Chandler, Ariz.) and Shan Zhong (Chandler, Ariz.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Package assemblies for and methods of packaging integrated circuit chips are described. Disclosed package assemblies have spacers and recessed regions comprising IC chips. Architectural structures are provided that enable, for example, three dimensional (3D) packaging (or system in package (SiP) or multi-chip modules), systems-on-chip 3D packaging, and hybrid 3D bonding. Embodime...