US Patent Issued to EXEDY on June 24 for "Thermal dissipation structure and drive unit" (Japanese Inventors)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,342,506, issued on June 24, was assigned to EXEDY Corp. (Neyagawa, Japan).

"Thermal dissipation structure and drive unit" was invented by Taichi Ohno (Neyagawa, Japan) and Taichi Kitamura (Neyagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A thermal dissipation structure includes a housing, a thermal dissipation mechanism, and a seal member. The housing accommodates a heat-generating element. The thermal dissipation mechanism includes a thermal transfer part and a thermal dissipation part. The thermal transfer part is disposed inside the housing. The thermal transfer part is configured to transfer heat generated by the heat-generating elemen...