US Patent Issued to Everspin Technologies on April 29 for "Method of manufacturing integrated circuit using encapsulation during an etch process" (Arizona, California Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,290,001, issued on April 29, was assigned to Everspin Technologies Inc. (Chandler, Ariz.).

"Method of manufacturing integrated circuit using encapsulation during an etch process" was invented by Sanjeev Aggarwal (Scottsdale, Ariz.), Sarin A. Deshpande (San Jose, Calif.) and Kerry Joseph Nagel (Scottsdale, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of fabricating a magnetoresistive bit from a magnetoresistive stack includes etching through a first portion of the magnetoresistive stack using a first etch process to form one or more sidewalls. At least a portion of the sidewalls includes redeposited material after the etching. The method ...