ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,865, issued on Sept. 9, was assigned to EV GROUP E. THALLNER GMBH (St. Florian am Inn, Austria).
"Apparatus and method for bonding substrates" was invented by Dominik Zinner (Zell an der Pram, Austria), Thomas Wagenleitner (Aurolzmunster, Austria), Jurgen Markus Suss (Scharding, Austria), Thomas Plach (St. Florian am Inn, Austria) and Jurgen Mallinger (Senftenbach, Austria).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method for bonding a first substrate to a second substrate on mutually facing contact surfaces of the substrates includes a device in which the first substrate is mounted on a first chuck and the second substrate is mounted on a se...