ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,456,720, issued on Oct. 28, was assigned to EV Group E. Thallner GmbH (St. Florian am Inn, Austria).
"Method for bonding of chips" was invented by Markus Wimplinger (Ried in Kreis, Austria).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method for bonding chips onto a substrate or onto further chips. The chips are bonded onto the substrate or the further chips by means of a direct bond."
The patent was filed on Jan. 29, 2024, under Application No. 18/425,205.
*For further information, including images, charts and tables, please visit: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&...