ALEXANDRIA, Va., July 9 -- United States Patent no. 12,350,676, issued on July 8, was assigned to Essenlix Corp. (Monmouth Junction, N.J.).
"Assay using sample thickness multiplexing" was invented by Stephen Y. Chou (Princeton, N.J.), Wei Ding (Princeton, N.J.), Ji Qi (Hillsborough, N.J.) and Yufan Zhang (Monmouth Junction, N.J.).
According to the abstract* released by the U.S. Patent & Trademark Office: "One aspect of the present invention is to provide the device and methods for performing an assay that uses the multiplexing of sample thicknesses on the same plate. The sample thickness multiplexing can offer many information that is unavailable in using a single sample thickness."
The patent was filed on Aug. 15, 2023, under Applicatio...