US Patent Issued to Equiptest Engineering on May 27 for "Multi-beam cantilever style contact pin for IC testing" (Singaporean Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,313,650, issued on May 27, was assigned to Equiptest Engineering Pte Ltd (Singapore).

"Multi-beam cantilever style contact pin for IC testing" was invented by Michael Goh (Singapore), Chwee Hoe Ong (Singapore) and Kean Loon Khor (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integral electrical contact pin for electrically connecting a test terminal of tester load board with an IC terminal of an IC device, adapted for short test height. The integral electrical contact pin comprises an upper cantilever arm and lower cantilever arm connected at a back portion. The upper cantilever arm is movable between a first default position to a second a...