ALEXANDRIA, Va., June 6 -- United States Patent no. 12,281,018, issued on April 22, was assigned to Epro Development Ltd. (Kowloon, Hong Kong).
"Electrical device with silicon nano-particles" was invented by Albert Pui Sang Lau (Hung Hom, Hong Kong) and Lee Cheung Lau (Hung Hom, Hong Kong).
According to the abstract* released by the U.S. Patent & Trademark Office: "An electrical device that includes an electrically-conductive substrate having a flexible structure; and wherein the flexible structure is formed by coating, encapsulating, and entangling it with porous silicon nano-particles, and wherein the porous silicon nano-particles are produced according to steps of: (I) alloying a raw silicon material with at least one distillable alloy...