ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,446,165, issued on Oct. 14, was assigned to EPEC OY (Seinajoki, Finland).
"Electronic device and method for forming electronic device" was invented by Tuomo Yli-Taipalus (Seinajoki, Finland).
According to the abstract* released by the U.S. Patent & Trademark Office: "In the disclosed solution, an electronic device (1) includes a printed circuit board (4) having a flexible part (4c), and a support part (5). The printed circuit board is bent by making use of the flexible part (4c) so that at least a part of the printed circuit board is over a second part of the printed circuit board (4). The support part (5) is adapted to support the flexible part (4c)."
The patent was filed on June 2...