US Patent Issued to ENTEGRIS on June 3 for "Electrostatic chuck prepared by additive manufacturing, and related methods and structures" (Singaporean, American Inventors)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,322,634, issued on June 3, was assigned to ENTEGRIS INC. (Billerica, Mass.).

"Electrostatic chuck prepared by additive manufacturing, and related methods and structures" was invented by Chandra Venkatraman (Tyngsboro, Mass.), Scott Sirignano (Azle, Texas), Yan Liu (Lexington, Mass.), Subhash Guddati (Singapore), Thines Kumar Perumal (Singapore), Montray Leavy (Singapore), Jakub Rybczynski (Arlington, Mass.) and Carlo Waldfried (Middleton, Mass.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Described are electrostatic chucks that are useful to support a workpiece during a step of processing the workpiece, and electrostatic chuck base components prepared ...