ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,451,351, issued on Oct. 21, was assigned to ENKRIS SEMICONDUCTOR INC. (Suzhou, China).
"Method for preparing a substrate" was invented by Liyang Zhang (Suzhou, China) and Kai Cheng (Suzhou, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a method for preparing a substrate relate to the field of semiconductors. The method comprises the following steps: S1, providing a reaction container in which a base substrate is mounted; S2, conducting a metal source into the reaction container, and forming a thin film layer on a surface of the base substrate, wherein a part of a surface of the base substrate is covered by the thin film layer, so tha...