US Patent Issued to ENKRIS SEMICONDUCTOR on Oct. 14 for "Semiconductor structure and manufacturing method thereof" (Chinese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,446,244, issued on Oct. 14, was assigned to ENKRIS SEMICONDUCTOR INC. (Jiangsu, China).

"Semiconductor structure and manufacturing method thereof" was invented by Kai Cheng (Jiangsu, China) and Peng Xiang (Jiangsu, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure and a manufacturing method thereof are provided in the present disclosure. The semiconductor structure includes a semiconductor substrate; a plurality of stacked structures and a plurality of isolation structures on the semiconductor substrate, wherein the stacked structures are spaced apart each other, and each of the isolation structures are located between adjac...