US Patent Issued to ENKRIS SEMICONDUCTOR on July 8 for "Semiconductor structures and manufacturing methods thereof" (Chinese Inventors)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,356,763, issued on July 8, was assigned to ENKRIS SEMICONDUCTOR INC. (Jiangsu, China).

"Semiconductor structures and manufacturing methods thereof" was invented by Kai Cheng (Jiangsu, China) and Liyang Zhang (Jiangsu, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure and a manufacturing method thereof are provided. The semiconductor structure may include: a first epitaxial layer disposed on a substrate; a bonding layer disposed on the first epitaxial layer (where the bonding layer is provided with a first through-hole to expose the first epitaxial layer); a silicon substrate disposed on a side of the bonding layer away from t...