US Patent Issued to ENKRIS SEMICONDUCTOR on July 15 for "Semiconductor structure and substrate thereof, and manufacturing methods for semiconductor structures and substrates thereof" (Chinese Inventor)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,364,085, issued on July 15, was assigned to ENKRIS SEMICONDUCTOR INC. (Jiangsu, China).

"Semiconductor structure and substrate thereof, and manufacturing methods for semiconductor structures and substrates thereof" was invented by Kai Cheng (Jiangsu, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a semiconductor structure and substrate thereof, and manufacturing methods for semiconductor structure and substrate thereof. In the method for manufacturing the substrate, at least one of groove is provided in each subunit region on a surface of a premanufactured substrate, and the premanufactured substrate includes at lea...