US Patent Issued to ENKRIS SEMICONDUCTOR on Dec. 30 for "Semiconductor structure and method for manufacturing the same" (Chinese Inventor)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,444, issued on Dec. 30, was assigned to ENKRIS SEMICONDUCTOR INC. (Jiangsu, China).

"Semiconductor structure and method for manufacturing the same" was invented by Liyang Zhang (Jiangsu, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure and a method for manufacturing a semiconductor structure are provided. The semiconductor structure includes a driving substrate, a first epitaxial structure coupled to the driving substrate, and a second epitaxial structure coupled to the first epitaxial structure, where the driving substrate is selectively coupled to a first semiconductor layer and a second semiconductor layer of the fir...