ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,530, issued on Jan. 27, was assigned to Enkris Semiconductor (Wuxi) Ltd. (Wuxi, China).
"Semiconductor structure and method for preparing the same" was invented by Kai Cheng (Wuxi, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are a semiconductor structure and a method for preparing the same, relating to the field of semiconductor technologies. The semiconductor structure includes: a substrate; and a plurality of functional film layers stacked on the substrate, the plurality of functional film layers include a first semiconductor layer and a second semiconductor layer stacked with each other, the first semiconductor layer is arrange...