US Patent Issued to Enjet on Nov. 18 for "Additive manufacturing system and additive manufacturing method" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,472,680, issued on Nov. 18, was assigned to Enjet Co. Ltd. (Suwon-si, South Korea).

"Additive manufacturing system and additive manufacturing method" was invented by Do Young Byun (Seoul, South Korea), Vu Dat Nguyen (Suwon-si, South Korea) and Hyung Dong Lee (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The invention relates to an additive manufacturing system and additive manufacturing method comprising a printing platform that sprays a droplet and that deposits the droplet on a substrate or a build platform by attractive-force control of an electric field to form at least one layer of a laminated body in a layer by layer method...