ALEXANDRIA, Va., June 18 -- United States Patent no. 12,325,192, issued on June 10, was assigned to ENJET Co. LTD. (Suwon-si, South Korea).
"Printing apparatus for 3D surface" was invented by Do Young Byun (Seoul, South Korea), Shaheer Mohiuddin Khalil (Suwon-si, South Korea), Vu Dat Nguyen (Suwon-si, South Korea) and Baek Hoon Seong (Hwaseong-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a printing apparatus for a 3D surface, which performs printing by ejecting a droplet onto a 3D surface and controlling an electric field on an impact path of the droplet, the printing apparatus including: a ejecting environment information provider configured to provide ejecting environment inf...