US Patent Issued to ENEOS on Oct. 14 for "Composition for curable resin, cured product of said composition, production method for said composition and said cured product, and semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,441,833, issued on Oct. 14, was assigned to ENEOS Corp. (Tokyo).

"Composition for curable resin, cured product of said composition, production method for said composition and said cured product, and semiconductor device" was invented by Yoshinori Nishitani (Tokyo), Tatsuki Sato (Tokyo) and Masaki Minami (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "The invention provides a curable resin composition excellent in curability at low temperature for obtaining a cured product high in heat resistance, a cured product thereof, and methods of producing the curable resin composition and the cured product. Also provided is a semiconductor device using the ...