US Patent Issued to ENEOS on March 25 for "Composition for curable resins, cured product of said composition, production method for said composition and said cured product, and semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,258,472, issued on March 25, was assigned to ENEOS Corp. (Tokyo).

"Composition for curable resins, cured product of said composition, production method for said composition and said cured product, and semiconductor device" was invented by Yoshinori Nishitani (Tokyo), Tatsuki Sato (Tokyo) and Masaki Minami (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a curable resin composition being excellent in normal-temperature stability for obtaining cured product having high heat resistance, cured product thereof, methods of producing the composition and the product, and a semiconductor device using the product as sealant. Further provided is ...