ALEXANDRIA, Va., Feb. 19 -- United States Patent no. 12,230,424, issued on Feb. 18, was assigned to Encore Wire Corp. (McKinney, Texas).
"Bond wire payoff system and method" was invented by Jeremy T. Smith (The Colony, Texas).
According to the abstract* released by the U.S. Patent & Trademark Office: "System and method for improved bond wire payoff during the armoring process of armored cables and metal-clad cables is disclosed. A bond wire payoff system includes a bare bond wire; a bond wire payoff assembly; a sensor assembly connected to the bond wire payoff assembly, wherein the bare bond wire passes through the sensor assembly; a controller coupled with the sensor assembly, wherein the controller detects a break in the bare bond wire;...