US Patent Issued to EMCOM TECHNOLOGY on April 29 for "Package tray and case module including the package tray" (Taiwanese Inventor)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,285,103, issued on April 29, was assigned to EMCOM TECHNOLOGY INC. (Taipei, Taiwan).

"Package tray and case module including the package tray" was invented by Chu-Li Wang (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a package tray and a case module. The package tray includes a first frame and a second frame. The first frame has a first side and a second side. The second frame has a third side and a fourth side connected to the second side. Wherein, the length of the first side is greater than the length of the third side, and a plurality of positioning locations are distributed on both the first frame and...