US Patent Issued to Eliyan on Oct. 7 for "Complex system-in-package architectures leveraging high-bandwidth long-reach die-to-die connectivity over package substrates" (California Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,438,095, issued on Oct. 7, was assigned to Eliyan Corp. (Santa Clara, Calif.).

"Complex system-in-package architectures leveraging high-bandwidth long-reach die-to-die connectivity over package substrates" was invented by Syrus Ziai (Los Altos, Calif.) and Ramin Farjadrad (Los Altos, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A physical layer interconnect between chips/chiplets provides high bandwidth communication with low power requirements using an organic substrate such as a printed circuit board. An interface between first and second chiplets uses a separate chiplet, or a combination logic die and interconnect interface, interfacing with ...