US Patent Issued to Eliyan on Jan. 13 for "Multi-chip module (MCM) with scalable high bandwidth memory" (California Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,540, issued on Jan. 13, was assigned to Eliyan Corp. (Santa Clara, Calif.).

"Multi-chip module (MCM) with scalable high bandwidth memory" was invented by Ramin Farjadrad (Los Altos, Calif.), Syrus Ziai (Los Altos, Calif.), Curtis McAllister (Los Altos, Calif.) and Kevin Donnelly (Santa Cruz, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor devices, packaging architectures and associated methods are disclosed. In one embodiment, a multi-chip module (MCM) is disclosed. The MCM includes an active silicon substrate and a memory interface circuit configured to support N memory channels. The memory interface circuit has a primary interf...