US Patent Issued to Eliyan on Dec. 9 for "Low cost solution for 2.5D and 3D packaging using USR chiplets" (Nevada Inventor)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,494,469, issued on Dec. 9, was assigned to Eliyan Corp. (Santa Clara, Calif.).

"Low cost solution for 2.5D and 3D packaging using USR chiplets" was invented by Mohsen F. Rad (Las Vegas).

According to the abstract* released by the U.S. Patent & Trademark Office: "Systems and methods are provided for a system in a package (SiP) connectivity using one or more ultra short reach (USR) chiplets. The USR chiplet can receive/transmit data at a lower throughput and transmit/receive that data at a higher throughput over ultra short distances. The USR chiplet can be connected to a main integrated circuit (IC) using a high density interconnect or integrated with the main IC in a mold material. Th...