ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,411, issued on Jan. 20, was assigned to ELECTRONIC DESIGN & DEVELOPMENT CORP. (Tucson, Ariz.).
"3D glass modules" was invented by Sergio E. Cardona Jr. (Tucson, Ariz.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A hermetic glass module for wireless communication. The module may comprise a plurality of glass layers comprising a first layer having capacitors, inductors, and resonators, a second layer comprising capacitors, inductors, diplexers, and waveguides, a third layer comprising microchips, and capacitors, and a fourth layer comprising a glass cover layer, and antennas disposed within the glass cover layer. The plurality of glass layers may ea...