ALEXANDRIA, Va., June 10 -- United States Patent no. 12,294,986, issued on May 6, was assigned to EdgeQ Inc. (Santa Clara, Calif.).

"Systems and methods for application aware slicing in 5G layer 2 and layer 1 using fine grain scheduling" was invented by Vinay Ravuri (Cupertino, Calif.) and Sriram Rajagopal (Karnataka, India).

According to the abstract* released by the U.S. Patent & Trademark Office: "Advances in wireless technologies have resulted in the ability of a 5G communication system to support multiple wireless communication applications. Each of these applications requires special handling in all layers and more so in scheduler and physical layer. The present disclosure presents embodiments of dynamical creating a computation ins...