US Patent Issued to ECOPIA TECH on Aug. 19 for "Enhancing elevation models with landcover feature data" (Canadian, American Inventors)

ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,394,152, issued on Aug. 19, was assigned to ECOPIA TECH Corp. (Toronto).

"Enhancing elevation models with landcover feature data" was invented by Yuanming Shu (Toronto), Shuo Tan (Campbell, Calif.), Dawei Zai (Toronto), Ruijie Deng (Toronto), Zihao Chen (Toronto) and Andi Dai (Toronto).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods and systems for enhancing elevation models with landcover feature data are provided. An example method involves accessing geospatial imagery covering an area of interest that includes a three-dimensional landcover feature, generating a digital surface model that includes one or more above-ground points corresponding to...