US Patent Issued to ECOPIA TECH on Aug. 12 for "Platform for distributed landcover feature data review" (Canadian, American, Chinese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,387,456, issued on Aug. 12, was assigned to ECOPIA TECH Corp. (Toronto).

"Platform for distributed landcover feature data review" was invented by Yuanming Shu (Toronto), Shuo Tan (Campbell, Calif.), Tuan Zhao (Toronto) and Huansheng Mo (Guilin, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods and systems for extracting and reviewing landcover feature data are provided. An example method involves accessing geospatial imagery covering a geographic area and landcover feature data extracted from the geospatial imagery, subdividing the geospatial imagery into a grid of image tiles, assigning landcover feature data review technicians to review the...