ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,481,227, issued on Nov. 25, was assigned to ECLAT FOREVER MACHINERY Co. LTD. (Taoyuan, Taiwan).
"Substrate processing apparatus" was invented by Kun-Lin Chou (Taoyuan, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing apparatus includes a substrate cleaning apparatus. Accordingly, the present application can be used for the transfer of the substrate cleaning and insertion frame, in order to achieve the effect of facilitating the transfer of the substrate to subsequent processes."
The patent was filed on Nov. 28, 2022, under Application No. 17/994,414.
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