US Patent Issued to eChem Solutions on June 3 for "Method of removing photoresist, laminate, method of forming metallic pattern, polyimide resin and stripper" (Taiwanese Inventors)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,321,097, issued on June 3, was assigned to eChem Solutions Corp. (Taoyuan, Taiwan).

"Method of removing photoresist, laminate, method of forming metallic pattern, polyimide resin and stripper" was invented by Tz-Jin Yang (Taoyuan, Taiwan), Yung-Yu Lin (Taoyuan, Taiwan), Chi-Yu Lai (Taoyuan, Taiwan), Ming-Che Chung (Taoyuan, Taiwan) and Che-Wei Chang (Taoyuan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of removing a photoresist, a laminate, a method of forming a metallic pattern, a polyimide resin, and a stripper are provided. The method of removing the photoresist includes forming a release layer on a substrate, the release layer havi...