US Patent Issued to EBARA on Sept. 23 for "Substrate processing apparatus and method for controlling dressing of polishing member" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,420,378, issued on Sept. 23, was assigned to EBARA Corp. (Tokyo).

"Substrate processing apparatus and method for controlling dressing of polishing member" was invented by Yasumasa Hiroo (Tokyo) and Keita Yagi (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing apparatus that polishes a substrate by sliding the substrate on a polishing member, the substrate processing apparatus including a dresser that dresses the polishing member by swinging on the polishing member, the dresser being enabled to adjust a swing speed in a plurality of scanning areas set on the polishing member along a radial direction, a height detection section ...