US Patent Issued to EBARA on Sept. 16 for "Plating apparatus" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,416,092, issued on Sept. 16, was assigned to EBARA Corp. (Tokyo).

"Plating apparatus" was invented by Masaki Tomita (Tokyo) and Yasuyuki Masuda (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a technique that can suppress deterioration of plating quality of a substrate due to gas bubbles that remain entirely on a lower surface of a membrane.A plating apparatus 1000 includes a plating tank 10, a substrate holder 20, and a membrane module 40. The membrane module includes a first membrane 41 and a second membrane 42. The second membrane has an inflow port 42c for causing a plating solution in a first region R1 below the second membrane t...