ALEXANDRIA, Va., June 12 -- United States Patent no. 12,297,555, issued on May 13, was assigned to EBARA Corp. (Tokyo).
"Apparatus for plating and method of controlling apparatus for plating" was invented by Yasuyuki Masuda (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "An object is to reduce the field shielding effect of a paddle during plating. There is provided an apparatus for plating that is configured to plate a substrate and comprises a plating tank; an anode placed in the plating tank; a rotation mechanism configured to rotate the substrate in a first direction and in a second direction that is opposite to the first direction; and a control device configured to control the rotation mechanism, ...