US Patent Issued to EBARA on March 25 for "Plating apparatus" (Japanese Inventor)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,258,673, issued on March 25, was assigned to EBARA Corp. (Tokyo).

"Plating apparatus" was invented by Masaki Tomita (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a plating apparatus that allows suppressing a substrate sticking to a back plate assembly.A plating apparatus includes a plating tank configured to house a plating solution, a substrate holder configured to hold a substrate Wf with a surface to be plated Wf-a facing downward, and an elevating mechanism configured to move up and down the substrate holder. The substrate holder includes a supporting mechanism 460 configured to support an outer peripheral portion of the surface...