US Patent Issued to EBARA on June 3 for "Substrate processing apparatus and substrate processing method" (Japanese Inventors)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,322,609, issued on June 3, was assigned to EBARA Corp. (Tokyo).

"Substrate processing apparatus and substrate processing method" was invented by Kohei Sato (Tokyo) and Hiroki Takahashi (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing apparatus includes: a first module used in a substrate processing process; a second module used in a substrate processing process after the first module; a nozzle provided in the second module and configured to supply a target treatment liquid; a temperature detector that detects a temperature of a treatment liquid inside the nozzle or a temperature of the nozzle; a substrate detection sensor that...