US Patent Issued to EBARA on June 3 for "Substrate polishing apparatus and substrate polishing method" (Japanese Inventors)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,318,881, issued on June 3, was assigned to EBARA Corp. (Tokyo).

"Substrate polishing apparatus and substrate polishing method" was invented by Takuya Fujimoto (Tokyo) and Nobuyuki Takada (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "The substrate polishing apparatus capable of measuring a film thickness of a substrate with high accuracy without decreasing a transmittance of light when measuring the film thickness of a substrate being polished is disclosed. The substrate polishing apparatus includes: a stage; a polishing head configured to hold a polishing pad; a polishing-liquid supply nozzle; a film-thickness measuring head; a spectrum analyzer;...