ALEXANDRIA, Va., June 18 -- United States Patent no. 12,325,101, issued on June 10, was assigned to EBARA Corp. (Tokyo).
"Polishing apparatus and polishing method" was invented by Masaki Kinoshita (Tokyo), Takashi Kishi (Tokyo) and Toshiki Miyakawa (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A polishing apparatus capable of preventing condensation on an inner surface of a transparent window provided in a polishing pad and capable of achieving accurate measuring of a film thickness is disclosed. The polishing apparatus includes: a polishing pad having a polishing surface; a polishing head configured to press a workpiece against the polishing surface; a transparent window disposed in the polishing pa...