ALEXANDRIA, Va., July 9 -- United States Patent no. 12,350,787, issued on July 8, was assigned to EBARA Corp. (Tokyo).
"Substrate processing apparatus" was invented by Kuniaki Yamaguchi (Tokyo), Itsuki Kobata (Tokyo), Toshio Mizuno (Tokyo), Mitsuru Miyazaki (Tokyo), Naoki Toyomura (Tokyo) and Takuya Inoue (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "An embodiment of the present invention provides a buff process module. The buff process module includes: a buff table on which a processing target object is mounted; a buff head that holds a buff pad for applying a predetermined process to the processing target object; a buff arm that supports and swings the buff head; a dresser for dressing the buff pad...